1.2 x 1.0 x 0.35mm Tuning Fork

– 4 pad

K124

DATASHEET

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Title / Description: K124 STANDARD SPECIFICATIONS

Drawing Number: K124-DOC-1

Size: A

Part Number:

Cage: 61429

Draftsperson: BEC

Approved: MAJ

Revision Date: 06/03/2020

Page 3 of 3

Crystal Unit Handling Precautions

1) Mounting Precautions

• If the board is deformed, such as bending after mounting, peeling of the soldered joint between the crystal

resonator and board may occur producing a crack in the ceramic package, leading to loss of vacuum,

destruction of the internal element, etc. Especially when depaneling the board on which it is mounted, there is a

possibility that a large stress may be applied, please consider board layout and cutting method to minimize

stress on products.

• When the product is automatically mounted on the board, if a large impact is applied to the crystal resonator,

there is a possibility that characteristics may change / deteriorate, or the product may be broken. When

mounting automatically, please set conditions considering the shock to the crystal unit. Also, please conduct the

mounting test beforehand and confirm that there is no influence on the characteristics to the crystal resonator.

• Cracks may occur in the soldered part by repeated harsh temperature changes for a long time when mounting

due to the board having a expansion coefficient different from that of the ceramics used in the crystal package.

When using under such circumstances, please conduct test beforehand and confirm that there is no influence

on the crystal unit.

• Ceramic packages are small and thin products. So, if/when you rework after mounting, please give

consideration to the selection and handling of the tools to be used.

2) Soldering

Following is typical SMD Pb-free reflow profile for soldering:

Excessive heating time at high temperature may result in deterioration of the characteristics and may break the

crystal unit. For manual rework, heat the lead part at 300

℃ or lower for 5 seconds or less.

3) Cleaning

Since a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an

ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning.