ISO6741F datasheet(6/35 Pages) TI

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6.4 Thermal Information

THERMAL METRIC(1)

ISO674x

UNIT

DW (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36.1

°C/W

RθJB

Junction-to-board thermal resistance

40.4

°C/W

ψJT

Junction-to-top characterization parameter

°C/W

ψJB

Junction-to-board characterization parameter

39.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6731

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

137.5

PD1

Maximum power dissipation (side-1)

68.75

PD2

Maximum power dissipation (side-2)

68.75

ISO6740

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

130.4

PD1

Maximum power dissipation (side-1)

32.5

PD2

Maximum power dissipation (side-2)

97.6

ISO6741

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

134.9

PD1

Maximum power dissipation (side-1)

50.8

PD2

Maximum power dissipation (side-2)

84.1

ISO6742

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

137.5

PD1

Maximum power dissipation (side-1)

68.75

PD2

Maximum power dissipation (side-2)

68.75

ISO6741

SLLSFJ6A – AUGUST 2020 – REVISED OCTOBER 2020

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