ICS8534-01 datasheet(11/17 Pages) ICST

Part #	ICS8534-01

Description	LOW SKEW, 1-TO-22 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER

PDF	17 Pages

Scroll/Zoom	100%

Manufacturer	ICST [Integrated Circuit Systems]

Direct Link	http://www.icst.com

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11 / 17 page

8534AY-01

www.icst.com/products/hiperclocks.html

REV. A NOVEMBER 19, 2004

Integrated

Circuit

Systems, Inc.

ICS8534-01

LOW SKEW, 1-TO-22

DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER

EXPOSED PAD

Expose Metal Pad

(GROUND PAD)

GROUND PLANE

SOLDER

SIGNAL

TRACE

SIGNAL

TRACE

THERM AL VIA

SOLDER M ASK

FIGURE 6. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE

THERMAL RELEASE PATH

The exposed metal pad provides heat transfer from the device

to the P.C. board. The exposed metal pad is ground pad con-

nected to ground plane through thermal via. The exposed pad

on the device to the exposed metal pad on the PCB is con-

tacted through solder as shown in

Figure 6. For further informa-

tion, please refer to the Application Note on Surface Mount As-

sembly of Amkor’s Thermally /Electrically Enhance Leadframe

Base Package, Amkor Technology.

ICS8534-01 Datasheet(PDF) 11 Page - Integrated Circuit Systems