STM8S003F3 datasheet(96/103 Pages) STMICROELECTRONICS

96 / 103 page

Package information

STM8S003F3 STM8S003K3

96/103

DS7147 Rev 10

10.4

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 19: General operating conditions.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

•

TAmax is the maximum ambient temperature in ° C

•ΘJA is the package junction-to-ambient thermal resistance in ° C/W

•

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

•

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

•

PI/Omax represents the maximum power dissipation on output pins, where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), and taking account of the actual VOL/IOL and

VOH/IOH of the I/Os at low and high level in the application.

10.4.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

Table 55. Thermal characteristics(1)

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP 32 - 7 x 7 mm

°C/W

Thermal resistance junction-ambient

TSSOP20 - 4.4 mm

Thermal resistance junction-ambient

UFQFPN20 -3 x 3 mm

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