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5010 Datasheet(PDF) 2 Page - 3M Electronics

Part # 5010
Description  3M™ Polyurethane Multi-Purpose Adhesive 5010
PDF  5 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

5010 Datasheet(HTML) 2 Page - 3M Electronics

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3M™ Polyurethane Multi-Purpose Adhesive 5010
Technical Information Note
The following technical information and data should be considered representative or typical only and should not be used for speci cation purposes.
Typical Uncured Physical Properties
Consistency: Thixotropic paste
Typical Cured Characteristics
Property
Values
Method
Modulus at 100% Elongation
11.7 MPa
1700 lb/in²
ASTM D412
Typical Performance Characteristics
Property
Values
Method
Tensile Strength
1.9 MPa
275 lb/in²
ASTM D412
Service Temperature Range
-30 to 100 °C
-22 to 212 °F
Overlap Shear Strength
Substrate
Failure mode
4.7 MPa
686 lb/in²
Fir
Substrate Broke / Gross Failure
7.2 MPa
1042 lb/in²
Stainless Steel
Cohesive
6.2 MPa
905 lb/in²
Aluminum
Cohesive
7 MPa
1011 lb/in²
Cold Rolled Steel
Adhesive
1.8 MPa
262 lb/in²
Nylon
Adhesive
3.6 MPa
528 lb/in²
ABS
Adhesive
3.4 MPa
492 lb/in²
Acrylic (PMMA)
Substrate Broke / Gross Failure
2.5 MPa
357 lb/in²
Polycarbonate (PC)
Cohesive
11.5 MPa
1668 lb/in²
FRP Green
Cohesive
0.4 MPa
51 lb/in²
Polypropylene (PP)
Adhesive
0.6 MPa
90 lb/in²
Low Density Polyethylene (LDPE)
Adhesive
5.4 MPa
790 lb/in²
PVC
Substrate Broke / Gross Failure
2.3 MPa
333 lb/in²
Glass
Substrate Broke / Gross Failure
Property: Overlap Shear Strength
Dwell/Cure Time: 30 day
Surface Preparation: Abrade and solvent wipe
notes: The following data represents the overlap shear results of a 17 mil bond line. All substrates were abraded and solvent wiped prior to bonding, then cured for
30 days. Actual values will vary, as the nal bond strengths are dependent upon many variables such as substrate type, substrate uniformity, and environmental
conditions. The following data should be considered representative or typical only and should not be used for speci cation purposes. Poor curing after 30 days
with non-porous substrates, Metals, PC, PE were 50-75% cured.



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