Can serve as:

• Anti-migration coating for displays, spindle motors

or lubricated electronic parts

• Anti-corrosion coating for a variety of materials

and components

Grade Coating solids in application baths or can

be combined with other materials to create unique

formulations

• Designed for moisture and corrosion

protection of printed circuit boards

and electronic components

• Low surface energy allows

lubricating oils, silicones,

photoresist solutions, etc.

to bead and drain freely from

coated surfaces

• Helps provide repellency and anti-

wetting properties against liquids –

water, hydrocarbons, silicones

and photoresists

• Helps protect against corrosive gases

and vapors in addition to liquids

• The polymer can endure up to 175°C

(347°F) for 24 hours and maintain

repellency

• Essentially insoluble in solvents such

as heptanes, toluene and water

• Adheres to a variety of materials

(metals, glass, ceramics, polymers,

composites, laminates)

• Thermally and electrically stable

with good dielectric properties

• Easy to apply – dries quickly without

the need for post-application curing

• Excellent surface wetting, especially

under low standoff SMT components

• Allows solder-through repairability

• Non-flammable, non-ozone-depleting,

and low in toxicity

• Low in global warming potential

(GWP), RoHS compliant and volatile

organic compound (VOC) exempt

Table 2: Typical physical properties

Not for specification purposes. All values @ 25°C unless otherwise specified.

Properties

Fluorinated Polymer Coating

Appearance

Transparent, colorless

Coating Thickness

0.1-1.0 microns (depending on application method)

Solvent and Chemical Resistance

Resists a variety of solvents and chemicals. Dissolves in acetone.

Tg (Glass Transition Temperature)

44.5°C (112°F)

Thermal Stability of Dry Film MIL-B-81744A

Repellent to chlorinated silicone oil after 24 hours at 175°C (347°F)

Contact Angles (Static, Dip Coated/Dried on Glass Substrate)

105° (water), 65° (hexadecane)

Refractive Index

1.39

Solder-Through Repairability

Yes (see SDS for thermal decomposition products)

Non-Flammable

Meets UL 94 V-0

Coefficient of Thermal Expansion - TMA

70 µm/(m·°C)

Thermal Conductivity

0.1 W/m*K

Dielectric Constant @30% RH per ASTM D150

3.2 (@1kHz)

Dissipation Factor @30% RH per ASTM D150

0.002 (@1kHz)

Dielectric Breakdown Strength @20°C, 30% RH per ASTM D149

2000 V/mil

*Measured contact angles can vary based on the type of surface, surface roughness and the application method.

Applications

Features

Helps provide:

• Moisture, chemical and corrosion protection for

printed circuit boards and their components

• An easy and cost-effective alternative to conformal

coatings

• Anti-wetting, anti-stiction, anti-migration and

anti-corrosion properties in many diverse applications

*

The U.S. EPA defines a VOC as “any compound of carbon, excluding carbon monoxide, carbon dioxide, carbonic acid, metallic carbides or carbonates and

ammonium carbonate, which participates in atmospheric photochemical reactions, except those designated by the EPA as having negligible photochemical

reactivity.” This product is VOC exempt per the U.S. EPA.