TITLE

DRAWING NO. REV.

32F, 32-lead, Non-windowed, Ceramic Bottom-brazed

Flat Package (FlatPack)

B

32F

10/21/03

Dimensions in Millimeters and (Inches).

Controlling dimension: Inches.

JEDEC Outline MO-115 AA

PIN #1 ID

9.40(0.370)

6.86(0.270)

0.51(0.020)

0.38(0.015)

1.27(0.050) BSC

1.14(0.045) MAX

3.05(0.120)

2.49(0.098)

1.14(0.045)

0.66(0.026)

1.83(0.072)

0.76(0.030)

10.36(0.408)

9.02(0.355)

0.18(0.007)

0.10(0.004)

12.40(0.488)

11.99(0.472)

21.08(0.830)

20.60(0.811)

Note: 

For the most current package drawings, please see the Microchip Packaging Specification located at http://

www.microchip.com/packaging.

AT28C010

Packaging Information

DS20006311A-page 24