AD8421 datasheet(26/28 Pages) AD

26 / 28 page

LT6372-1

Rev. 0

For more information www.analog.com

PACKAGE DESCRIPTION

3.00

±0.10

1.50 REF

4.00

±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

±0.10

19 20

BOTTOM VIEW—EXPOSED PAD

2.50 REF

0.75

±0.05

R = 0.115

TYP

PIN 1 NOTCH

R = 0.20 OR 0.25

× 45° CHAMFER

0.25

±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UDC20) QFN 1106 REV Ø

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70

±0.05

0.25

±0.05

2.50 REF

3.10

±0.05

4.50

±0.05

1.50 REF

2.10

±0.05

3.50

±0.05

PACKAGE OUTLINE

R = 0.05 TYP

1.65

±0.10

2.65

±0.10

1.65

±0.05

2.65

±0.05

0.50 BSC

UDC Package

20-Lead Plastic QFN (3mm

× 4mm)

(Reference LTC DWG # 05-08-1742 Rev Ø)

AD8421 Datasheet(PDF) 26 Page - Analog Devices

AD8421 Datasheet(HTML) 26 Page - Analog Devices

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