eX Fam i l y FP G A s
2v3.0
O r de rin g I n fo rm a t io n
Pr od uc t P l a n
Application (Temperature Range)
Blank = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
PP = Pre-production
Package Type
TQ = Thin (1.4mm) Quad Flat Pack
CS = Chip-Scale Package (0.8mm pitch)
Speed Grade
Blank = Standard Speed
–P = Approximately 30% Faster than Standard
–F = Approximately 40% Slower than Standard
Part Number
eX64
=
64 Dedicated Flip-Flops (3,000 System Gates)
eX128 =
128 Dedicated Flip-Flops (6,000 System Gates)
eX256 =
256 Dedicated Flip-Flops (12,000 System Gates)
Package Lead Count
eX128
TQ
100
–P
Speed Grade
Application
–FStd
–PC
I†
eX64 Device
64-Pin Thin Quad Flat Pack (TQFP)
✔✔
✔
✔
✔
100-Pin Thin Quad Flat Pack (TQFP)
✔✔
✔
✔
✔
49-Pin Chip Scale Package (CSP)
✔✔
✔
✔
✔
128-Pin Chip Scale Package (CSP)
✔✔
✔
✔
✔
eX128 Device
64-Pin Thin Quad Flat Pack (TQFP)
✔✔
✔
✔
✔
100-Pin Thin Quad Flat Pack (TQFP)
✔✔
✔
✔
✔
49-Pin Chip Scale Package (CSP)
✔✔
✔
✔
✔
128-Pin Chip Scale Package (CSP)
✔✔
✔
✔
✔
eX256 Device
100-Pin Thin Quad Flat Pack (TQFP)
✔✔
✔
✔
✔
128-Pin Chip Scale Package (CSP)
✔✔
✔
✔
✔
180-Pin Chip Scale Package (CSP)
✔✔
✔
✔
✔
Contact your Actel sales representative for product availability.
Speed Grade:
–P = Approx. 30% faster than Standard
Availability:
✔ = Available
Applications:
C = Commercial
–F = Approx. 40% slower than Standard
I
= Industrial
† Only Std Speed Grade
P l ast i c Dev i ce R e s our c e s
User I/Os (including clock buffers)
Device
TQFP 64-Pin
TQFP 100-Pin
CSP 49-Pin
CSP 128-Pin
CSP 180-Pin
eX64
41
56
36
84
—
eX128
46
70
36
100
—
eX256
—
81
—
100
132
Package Definitions:
TQFP = Thin Quad Flat Pack, CSP = Chip Scale Package
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