6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage range

VCC

–0.3

7

V

Voltage range USB data

DxP, DxM

–0.3

5.5

V

Voltage range on BOOST pin

BOOST

-0.3

1.98

V

Voltage range other pins

RX_SEN,CDP_ENZ,SDA,SCL, RSTN

-0.3

5.5

V

–65

150

°C

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per

±2000

V

Charged-device model (CDM), per

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.3

5

6.5

V

Operating free-air temperature (Industrial)

–40

85

°C

Junction temperature (Industrial)

105

°C

I2C Bus Voltage

1.62

3.6

V

DxP, DxM

Voltage range USB data

0

3.6

V

BOOST

Voltage range BOOST pin

0

1.98

V

CDP_ENZ

Voltage range other pins (SCL, SDA, RSTN, CDP_ENZ)

0

3.6

V

RX_SEN

Voltage range RX_SEN pin

0

5.0

V

6.4 Thermal Information

THERMAL METRIC (1)

RWB (X2QFN)

UNIT

12 PINS

Junction-to-ambient thermal resistance

137.4

°C/W

Junction-to-case (top) thermal resistance

62

°C/W

Junction-to-board thermal resistance

67.2

°C/W

Junction-to-top characterization parameter

1.9

°C/W

Junction-to-board characterization parameter

67.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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TUSB216I

SLLSFM9 – MARCH 2021

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