SM1K16CF datasheet(4/5 Pages) LEIDITECH

4 / 5 page

SOLDERING PARAMETERS

Reflow Condition

Pb-Free assembly

(see FIG.4)

Pre

Heat

-Temperature Min (Ts(min))

+150℃

-Temperature Max(Ts(max))

+200℃

-Time (Min to Max) (ts)

60-180 secs.

Average ramp up rate (Liquidus Temp

(TL)to peak)

3℃/sec. Max

Ts(max) to TL - Ramp-up Rate

3℃/sec. Max

Reflow

-Temperature(TL)(Liquidus)

+217℃

-Temperature(tL)

60-150 secs.

Peak Temp (Tp)

+260(+0/-5)℃

Time within 5℃of actual Peak Temp (tp)

20-40secs

Ramp-down Rate

6℃/sec. Max

Time 25℃ to Peak Temp (TP)

8 min. Max

Do not exceed

+260℃

PACKAGE MECHANICAL DATA

Dimensions

Millimeters

Inches

Ref.

Min.

Max.

Min.

Max.

3.90

4.65

1.85

0.60

4.50

5.15

2.15

0.154

0.183

0.073

0.024

0.177

0.203

0.085

5.60

6.00

0.12

2.30

0.091

0.220

0.236

0.28

0.005

0.011

2.00

0.079

2.05

2.35

0.081

0.093

3.20

0.126

SMBF

FIG.4:

Reflow condition

TS(min)

TS(max)

time to peak temperatue

Time

(t 25

to peak)

℃

Ramp-up

Ramp-down

Preheat

Critical Zone

TL to TP

SM1KxxCF Series Transient Voltage Suppressor

Rev :

www.leiditech.com

01.06.2018

4/5

SM1K16CF Datasheet(PDF) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd

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