VSC830 datasheet(9/18 Pages) VITESSE

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VITESSE

SEMICONDUCTOR CORPORATION

Data Sheet

VSC830

Dual 2x2 Crosspoint Switch

2.7Gb/s Asynchronous

G52192-0, Rev 4.0

Page 9

05/23/01

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Package Thermal Characteristics

The VSC830 is packaged into a standard plastic quad flatpack with an embedded, but unexposed thermal

slug. This package adheres to industry-standard EIAJ footprints for a 10x10mm body, 44 lead PQFP. The pack-

age construction is as shown in Figure 4. The 44-pin PQFP with embedded slug has the thermal properties

shown in Table 11. This package allows the VSC830 to operate with ambient temperatures up to 70oC in still

air.

Figure 4: Package Cross Reference

Table 11: 44-Pin PQFP Thermal Resistance

NOTE: TA(MAX) = max case temperature - (max power dissipation • θCA AIRFLOW).

Symbol

Description

Value

(oC/W)

TA(MAX)

(oC)

CA-0

Thermal resistance from case-to-ambient, still air

28.4

50.9

CA-100

Thermal resistance from case-to-ambient, 100 LFPM air

22.7

57.8

CA-200

Thermal resistance from case-to-ambient, 200 LFPM air

19.9

61.1

CA-400

Thermal resistance from case-to-ambient, 400 LFPM air

16.2

65.6

CA-600

Thermal resistance from case-to-ambient, 600 LFPM air

13.9

68.3

Lead

Die

Plastic Molding Compound

Insulator

Wire Bond

Copper Heat Spreader

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