SURFACE MOUNT LED LAMPS

Low Current Type (IF≦10mA) Mini-molded chip LEDs

SML412 Series

(Typ.)

The recommended thickness of the screen mask

for soldering is between 100 and 200μm. The

hole size of the screen mask should be same as

the recommended land pattern or smaller.

1608

(0603)

1.6

×0.8

t=0.4

(mA)

Typ.

(V)

Typ.

(mcd)

Typ.

(nm)

λp

Typ.

(nm)

Min.

(

(mA)

(mA)

Max.

(

µA)

Tolerance:

±0.1

(V)

∆λ

Feeding direction

2

4

φ1.5

0.95

0.5

φ13

φ60

φ180

Package Size

（mm）

Tape Spacifications：T86〈5,000pcs／reel〉

Reel Spacifications

Blue

InGaN on SiC

0.8

（Unit：mm）

Peak

forward

current

（mA）

Part No.

Power

dissipation

（mW）

Forward

current

（mA）

Reverse

voltage

（V）

Operating

temperature

（

°C）

Stotage

temperature

（

°C）

Emitting

color

Part No.

Forward

voltage

Light wavelength

Reverse

current

Brightness

Resin Color

Peak Half-wave

468nm

SML412BC4T

Note) "-" will be taken out for emitting color B series.

SML412BC4T

Blue

74

20

100

5

-30 to +85

-40 to +100

SML412BC4T

5

100

5

468

5.6

14

26

5

5

2.9

1.6

1.2

Die

Electrode

0.8

Tolerance:

±0.1

0

50

100

50

100

0

°

30

°

60

°

90

°

30

°

60

°

90

°

Relative INTENSITY (

%)

SCANNING ANGLE (deg)

Transparent Clear

Y’

X’