Electronic Components Datasheet Search
  English  ▼

X  

HM4863 Datasheet(PDF) 13 Page - Shenzhen Huazhimei Semiconductor Co., Ltd

Part # HM4863
Description  Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
PDF  21 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  HMSEMI [Shenzhen Huazhimei Semiconductor Co., Ltd]
Direct Link  http://www.hmsemi.com/
Logo HMSEMI - Shenzhen Huazhimei Semiconductor Co., Ltd

HM4863 Datasheet(HTML) 13 Page - Shenzhen Huazhimei Semiconductor Co., Ltd

Back Button HM4863 Datasheet HTML 9Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 10Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 11Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 12Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 13Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 14Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 15Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 16Page - Shenzhen Huazhimei Semiconductor Co., Ltd HM4863 Datasheet HTML 17Page - Shenzhen Huazhimei Semiconductor Co., Ltd Next Button
Zoom Inzoom in Zoom Outzoom out
 13 / 21 page
background image
Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
Application Information
Exposed-DAP Mounting Considerations
The exposed-DAP must be connected to ground.
The exposed-DAP package of the HM4863 re-
quires special attention to thermal design. If
thermal design issues are not properly addressed,
an HM4863 driving 4Ω will go into thermal shut-
down.
The exposed-DAP on the bottom of the HM4863
should be soldered down to a copper pad on the
circuit board. Heat is conducted away from the
exposed-DAP by a copper plane. If the copper
plane is not on the top surface of the circuit board,
8 to 10 vias of 0.013 inches or smaller in diameter
should be used to thermally couple the exposed-
DAP to the plane. For good thermal conduction,
the vias must be plated-through and solder-filled.
The copper plane used to conduct heat away from
the exposed-DAP should be as large as pratical. If
the plane is on the same side of the circuit board
2
as the exposed-DAP,2.5in is the minimum for 5V
operation into 4Ω. If the heat sink plane is buried
2
or not on the same side as the exposed-DAP, 5in
is the minimum for 5V operation into 4Ω. If the
ambient temperature is higher than 25°C, a larger
copper plane or forced-air cooling will be required
to keep the HM4863 junction temperature below
the thermal shutdown temperature (150°C). See
the power derating curve for the HM4863 for
derating information.
The HM4863 requires forced-air cooling when
2
operating into 3Ω. With the part attached to 2.5in
of exposed copper,with a 3Ω load, and with an
ambient temperature of 25°C,450 linear-feet per
minute kept the part out of thermal shutdown.
In higher ambient temperatures, higher airflow
rates and/or larger copper areas will be required
to keep the part out of thermal shutdown.
from the output pins of the HM4863. Traces from
the output of the HM4863 to the load or load
connectors should be as wide as practical.Any
resistance in the output traces will reduce the
power delivered to the load. For example, with a
4Ω load and 0.1Ω of trace resistance in each
output, output power at the load drops from 2.2W
to 2.0W
. Output power is also dependent on
supply regulation. To keep the supply voltage
from sagging under full output power conditions,
the supply traces should be as wide as practical.
Bridge Configuration Explanation
As shown in Figure 1, the HM4863 has two pairs
of operational amplifiers internally, allowing for
a few different amplifier configurations. The
first amplifier’s gain is externally configurable,
while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-
loop gain of the first amplifier is set by selecting
the ratio of Rf to R i while the second amplifier’s
gain is fixed by the two internal 20 kΩ resistors.
Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results
in both amplifiers producing signals identical in
magnitude, but out of phase180°.Consequently,
the differential gain for eachchannel of the IC is
AVD = 2 * (Rf/Ri)
By driving the load differentially through outputs
+OutA and −OutA or +OutB and −OutB, an
amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode
operation is different from the classical single-
ended amplifier configuration where one side of
its load is connected to ground.
13
3Ω & 4Ω Layout Considerations
With low impedance loads, the output power at
the loads is heavily dependent on trace resistance
HM4863
Shenzhen H&M Semiconductor Co.Ltd
http://www.hmsemi.com



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com