11.2 Documentation Support

11.2.1 Related Documentation

The following documents are relevant to using the OPAx210 and recommended for reference. All are available

for download at www.ti.com (unless otherwise noted):

• Texas Instruments, OPA827 Low-Noise, High-Precision, JFET-Input Operational Amplifier data sheet

• Texas Instruments, OPA2x11 1.1-nv/√Hz Noise, Low-Power, Precision Operational Amplifier data sheet

• Texas Instruments, OPA210, OPA2210, OPA4210 EMI Immunity Performance technical brief

• Texas Instruments, OPAx209 2.2-nV/√Hz, Low-Power, 36-V Operational Amplifier data sheet

• Texas Instruments, Microcontroller PWM to 12-Bit Analog Out design guide

• Texas Instruments, Capacitive Load Drive Solution Using an Isolation Resistor design guide

• Texas Instruments, Noise Measurement Post Amp design guide

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

11.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

All trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

OPA210, OPA2210

SBOS924G – SEPTEMBER 2018 – REVISED APRIL 2021

Copyright © 2021 Texas Instruments Incorporated

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Product Folder Links: OPA210 OPA2210