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LTC3355 Datasheet(PDF) 4 Page - Analog Devices

Part # LTC3355
Description  20V 1A Buck DC/DC with Integrated SCAP Charger and Backup Regulator
PDF  18 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC3355 Datasheet(HTML) 4 Page - Analog Devices

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LTC3355-1
4
Rev. 0
For more information www.analog.com
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 12V unless otherwise noted. (Note 2)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
5A Boost Regulator
ISW2
SW2 Peak Current
RIBSTPK = 200k
4.5
5
5.5
A
RNMOS
NMOS On-Resistance
70
mΩ
ILEAKN
NMOS Leakage Current
Boost Disabled
–5
5
µA
DC Max
Boost Maximum Duty Cycle
88
92
98
%
VSBOOST
Boost Input Supply Voltage Range
0.75
5
V
Boost Minimum Input Supply
VOUT(MAX) = 4V
0.5
V
AV
Boost Error Amplifier Voltage Gain
(Note 5)
850
V/V
gm
Boost Error Amplifier Transconductance
27
μS
VIBSTPK
IBSTPK Reference Voltage
0.775
0.825
V
RIBSTPK
IBSTPK Set Resistor Range
200
1000
kΩ
Logic (EN_CHG)
VIL
Input Low Logic Voltage
0.4
V
VIH
Input High Logic Voltage
1.2
V
IIL, IIH
Input Low/High Current
-1
1
µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3355-1 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3355-1E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3355-1I is guaranteed over the –40°C to 125°C operating junction
temperature range. Note that the maximum ambient temperature
consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
impedance and other environmental factors. The junction temperature
(TJ, in °C) is calculated from the ambient temperature (TA, in °C) and
power dissipation (PD, in Watts) according to the formula:
TJ = TA + (PD • θJA)
where θJA = 47°C/W for the UF package.
Note 3: The LTC3355-1 has a thermal regulation loop that limits the
maximum junction temperature to 110°C by limiting the charger current.
Note 4: The current limit features of this part are intended to protect the
IC from short-term or intermittent fault conditions. Continuous operation
above the maximum specified pin current may result in device degradation
or failure.
Note 5: Guaranteed by design and/or correlation to static test.
Note 6: The LTC3355-1 has a thermal shutdown that will shut down the
part when the die temperature reaches 155°C.



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