LT3750 datasheet(16/18 Pages) AD

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LTC3355-1

Rev. 0

For more information www.analog.com

APPLICATIONS INFORMATION

High Temperature Considerations

The PCB must provide heat sinking to keep the LTC3355-1

cool. The exposed pad on the bottom of the package

may be soldered to a copper area which should be tied

to large copper layers below with thermal vias; these

layers will spread the heat dissipated by the LTC3355-

1. Place additional vias to reduce thermal resistance

further. With these steps, the thermal resistance from

the die (or junction) to ambient can be reduced to

θJA = 47°C/W or less. With 100 LFPM airflow, this resis-

tance can fall by another 25%.

The LTC3355-1 has two thermal circuits. The first ther-

mal circuit is operational when the buck and charger

are enabled. If the die temperature exceeds 110°C the

charge current will be reduced. When the LTC3355-1 is in

boost mode the high current thermal shutdown will turn

the boost off when the die temperature reaches 155°C.

The high temperature shutdown is active in all modes

of operation.

TYPICAL APPLICATIONS

Tantalum Capacitor Charger and Ride-Through Backup Supply

604k

1µF

VINS

VIN

CCAP

1µF

CVIN

10µF

CIN

10µF

1000µF

6.3V

TANT

47µF

VOUT

10mA

VIN

12V

2.49M

200k

523k

100k

VINM5

PFI

BUCK

PFO

BOOST

SW1

6.8µH

L2 3.3µH

VOUT

VCAP

SW2

CFB

VCBST

IBSTPK

ICHG

LTC3355-1

INTVCC

1.05M

200k

33551 TA02

154k

220pF

EN_CHG

GND

21 GND

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