LTC3355-1

17

Rev. 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

4.00 ±0.10

4.00 ±0.10

NOTE:

1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220

VARIATION (WGGD-1)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ±0.10

20

19

1

2

BOTTOM VIEW—EXPOSED PAD

2.00 REF

2.45 ±0.10

0.75 ±0.05

R = 0.115

TYP

R = 0.05

TYP

0.25 ±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UF20) QFN 01-07 REV A

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.25 ±0.05

0.50 BSC

2.00 REF

2.45 ±0.05

3.10 ±0.05

4.50 ±0.05

PACKAGE OUTLINE

PIN 1 NOTCH

R = 0.20 TYP

OR 0.35

× 45°

CHAMFER

2.45 ±0.10

2.45 ±0.05

UF Package

20-Lead Plastic QFN (4mm

× 4mm)

(Reference LTC DWG # 05-08-1710 Rev A)