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WB75FC65AL Datasheet(PDF) 4 Page - WeEn Semiconductors |
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WB75FC65AL Datasheet(HTML) 4 Page - WeEn Semiconductors |
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4 / 7 page ![]() WeEn Semiconductors WB75FC65AL Hyperfast power diode - Bare die WB75FC65AL Product data sheet All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2020. All rights reserved 08 September 2020 4 / 7 MECHANICAL PATAMETER Chip size 5.06 x 5.06 mm2 Anode pad size 4.5 x 4.5 mm2 Area total / active 25.6 / 20.25 mm2 Thickness 300 μm Wafer size 125 mm Max possible chips per wafer 418 pcs Passivation Glass Front metal Al Back metal Ti Ni Ag CHIP LAYOUT Die size: 5060m x 5060m Bond pad size: 4500m x 4500m 5060 4500 |
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