Absolute Maximum Ratings

PV, AV to GND ......................................................... -0.3V to +6V

SDA, SCL to GND .................................................... -0.3V to +6V

GND to PGND ....................................................... -0.3V to +0.3V

Output Short-Circuit Duration ..................................... Continuous

TQFN (derate 30.3mW/°C above +70°C).................2424.2mW

Operating Temperature Range ...........................-40°C to +125°C

Junction Temperature ....................................................... +150°C

Storage Temperature Range ..............................-65ºC to +150ºC

Lead Temperature (soldering, 10s)................................... +300ºC

Soldering Temperature (reflow) ........................................ +260ºC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

20 TQFN-EP

Package Code

T2044+4C

Outline Number

21-100172

Land Pattern Number

90-0409

20 SW TQFN-EP

Package Code

T2044Y+4C

Outline Number

21-100068

Land Pattern Number

90-0409

THERMAL RESISTANCE, SINGLE-LAYER BOARD

33°C/W

2°C/W

Note 1: Self-protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up

to the maximum rating output current.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7,

using a four-layer board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/

thermal-tutorial.

Electrical Characteristics

unless otherwise noted.) (Note 3 )

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

Fully operational

3.0

5.5

V

Undervoltage Lockout

UVLO

Rising

2.85

3

V

Falling

2.55

MAX20010C/MAX20010D/

MAX20010E

Automotive Single 6A Step-Down Converters

www.maximintegrated.com

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