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SN74HCS595DYY Datasheet(PDF) 4 Page - Texas Instruments

Part # SN74HCS595DYY
Description  SN74HCS595 8-Bit Shift Register With Schmitt-Trigger Inputs and 3-State Output Registers
PDF  34 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74HCS595DYY Datasheet(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < –0.5 V or VI > VCC + 0.5 V
±20
mA
IOK
Output clamp current(2)
VI < –0.5 V or VI > VCC + 0.5 V
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
Continuous current through VCC or GND
±70
mA
TJ
Junction temperature(3)
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
Guaranteed by design.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/
JEDEC JS-001(1)
±4000
V
Charged-device model (CDM), per JEDEC
specification JESD22-C101(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
TA
Ambient temperature
–40
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
SN74HCS595
UNIT
PW (TSSOP)
D (SOIC)
BQB (WQFN)
DYY (SOT-23)
16 PINS
16 PINS
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal
resistance
141.2
122.2
108.4
186.2
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
78.8
80.9
77.3
109.1
°C/W
RθJB
Junction-to-board thermal
resistance
85.8
80.6
74.4
111.0
°C/W
ΨJT
Junction-to-top characterization
parameter
27.7
40.4
12.6
18.0
°C/W
ΨJB
Junction-to-board characterization
parameter
85.5
80.3
74.5
110.9
°C/W
SN74HCS595
SCLS803B – OCTOBER 2020 – REVISED MAY 2021
www.ti.com
4
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Product Folder Links: SN74HCS595



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