µPD16635

16

RECOMMENDED CONDITIONS FOR INSTALLATION

This product should be installed under the following recommended conditions. Consult one of our sales

representatives for installation under conditions other than those recommended.

Installation

Installation method

Condition

condition

Thermocom-

Soldering

Heat with heating tool at 300

°C to 350 °C under pressure of

pression bonding

100 g (per pin) for 2 to 3 seconds

ACF (sheet-type adhesive agent)

Temporary adhesion at 70

°C to 100 °C under pressure of 3 to

Permanent adhesion at 165

°C to 180 °C under pressure of 25

(when aeolotropic conductive film SUMIZAC1003 from Sumitomo

Bakelite Co., Ltd. is used)

Caution

For installation conditions for the ACF part, contact the ACF manufacturer beforehand. Do not

mix different installation methods.

REFERENCE

Document name

Document No.

NEC semiconductor device reliability/quality control system

IEI-1212

Quality grade on NEC semiconductor devices

C11531E

Semiconductor device package manual

IEI-1213

Guide to quality assurance for semiconductor devices

MEI-1202

Semiconductor selection guide

X10679E