PIMXRT406LCAE4A datasheet(1/100 Pages) NXP

Part #	PIMXRT406LCAE4A

Description	i.MX RT1020 Crossover Processors for Industrial Products

PDF	100 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMXRT1020IEC

Rev. 2, 03/2021

MIMXRT1021CAG4A

MIMXRT1021CAF4A

Package Information

Plastic Package

144-Pin LQFP, 20 x 20 mm, 0.5 mm pitch

100-Pin LQFP, 14 x 14 mm, 0.5 mm pitch

Ordering Information

See Table 2 on page 6

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1020 introduction

The i.MX RT1020 is a processor of i.MX RT family

featuring NXP’s advanced implementation of the Arm®

Cortex®-M7 core, which operates at speeds up to 396

MHz to provide high CPU performance and real-time

response.

The i.MX RT1020 processor has 256 KB on-chip RAM,

which can be flexibly configured as TCM or

general-purpose on-chip RAM. The i.MX RT1020

integrates advanced power management module with

DCDC and LDO that reduces complexity of external

power supply and simplifies power sequencing. The

i.MX RT1020 also provides various memory interfaces,

including SDRAM, RAW NAND FLASH, NOR

FLASH, SD/eMMC, Quad SPI, and a wide range of

connectivity interfaces including UART, SPI, I2C, USB,

and CAN; for connecting peripherals including WLAN,

Bluetooth™, and GPS. The i.MX RT1020 also has rich

audio features, including SPDIF and I2S audio interface.

Various analog IP integration, including ADC, analog

comparator, temperature sensor, etc.

i.MX RT1020 Crossover

Processors for Industrial

Products

1. i.MX RT1020 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6

2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1. Special signal considerations . . . . . . . . . . . . . . . 15

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 17

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 24

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.5. External memory interface . . . . . . . . . . . . . . . . . 40

4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 60

4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 74

5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 74

5.2. Boot device interface allocation . . . . . . . . . . . . . . 74

6. Package information and contact assignments . . . . . . . 80

6.1. 20 x 20 mm package information . . . . . . . . . . . . 80

6.2. 14 x 14 mm package information . . . . . . . . . . . . 89

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

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