QPA1013D

6–18 GHz 10 W GaN Power Amplifier

Data Sheet Rev C, September 2019 | Subject to change without notice

13 of 15

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Mechanical Drawing & Bond Pad Description

Unit: millimeters

Thickness: 0.10

Die x, y size tolerance: +/- 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Bond Pad

Symbol

Pad Size

Description

1

RF In

0.115 x 0.190

RF Input; matched to 50 Ω; DC shorted to ground

2, 12

0.090 x 0.090

Circuit on page 11 as an example.

3, 11

0.190 x 0.090

Circuit on page 11 as an example

4, 10

0.235 x 0.090

Circuit on page 11 as an example.

5, 9

0.090 x 0.090

Circuit on page 11 as an example.

6, 8

0.508 x 0.090

Drain voltage 3, bias network is required; see Application

Circuit on page 11 as an example.

7

RF Out

0.115 x 0.190

RF Output; matched to 50 Ω; DC shorted to ground