LTC3336 datasheet(16/22 Pages) AD

16 / 22 page

application: Microcontroller Supply with Dynamic Output

Voltage Change in the Typical Applications section.

Table 4. Dynamic Operation Output Voltages with Single

Pin Tied High

PIN TIED HIGH

(DEFAULT)

VDEFAULT

(V)

DYNAMIC OUTPUT VOLTAGES AVAILABLE

WITH SINGLE PIN TIED HIGH

(V)

OUT0

1.2

1.2, 1.5, 2.4, 2.8, 3.3, 3.7, 4.1, 5.0

OUT1

1.8

1.5, 1.8, 2.0, 2.8, 3.6, 3.7, 4.2, 5.0

OUT2

2.5

2.0, 2.4, 2.5, 2.8, 3.2, 4.1, 4.2, 5.0

OUT3

3.0

3.0, 3.2, 3.3, 3.6, 3.7, 4.1, 4.2, 5.0

PCB LAYOUT CONSIDERATIONS

The LTC3336 switches large currents (relative to the IQ)

at high frequencies. Special care should be given to the

PCB layout to ensure stable, noise-free operation. Figure 2

depicts a recommended PCB layout to be utilized for the

LTC3336, if a 2-layer PCB is being used. A few key guide-

lines follow: All circulating high current paths should be

kept as short as possible using wide traces. In particular,

capacitor ground connections should connect by vias

down to the ground plane in the shortest route possible.

The bypass capacitors CIN and COUT should be placed as

close to the IC as possible.

LTC3336

Rev. 0

For more information www.analog.com

Figure 2. Recommended Component Placement on PCB

COUT

CIN

LPS4018

LTC3336

TOP LAYER

BOTTOM COPPER LAYER (GROUND PLANE) CONNECTED TO GND

SEE TYPICAL APPLICATION

ON FRONT PAGE

VIAS TO GROUND PLANE COMPONENT SIZES:

CIN = 0201

COUT = 1210

3336 F02

VIN

IPK1

IPK0

OUT0

OUT1

OUT2

OUT3

GND

APPLICATIONS INFORMATION

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