TGL2201

Wideband Dual Stage VPIN Limiter

Data Sheet Rev. C

– January, 2021

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Assembly Notes

Component placement and adhesive attachment assembly notes:

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Vacuum pencils and/or vacuum collets are the preferred method of pick up.

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Air bridges must be avoided during placement.

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The force impact is critical during auto placement.

Reflow process assembly notes:

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Use AuSn (80/20) solder and limit exposure to temperatures above 300 

C to 3 – 4 minutes, maximum.

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An alloy station or conveyor furnace with reducing atmosphere should be used.

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Do not use any kind of flux.

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Coefficient of thermal expansion matching is critical for long-term reliability.

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Devices must be stored in a dry nitrogen atmosphere.

Interconnect process assembly notes:

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Thermosonic ball bonding is the preferred interconnect technique.

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Force, time, and ultrasonic are critical parameters.

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Aluminum wire should not be used.

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Devices with small pad sizes should be bonded with 0.0007-inch wire.