ICS557-06 datasheet(4/10 Pages) ICST

4 / 10 page

MDS 557-06 C

Revision 010306

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ICS557-06

One to Four HCSL Clock Buffer

Output Structures

General PCB Layout Recommendations

For optimum device performance and lowest output

phase noise, the following guidelines should be

observed.

1. Each 0.01µF decoupling capacitor should be

mounted on the component side of the board as close

to the VDD pin as possible.

2. No vias should be used between decoupling

capacitor and VDD pin.

3. The PCB trace to VDD pin should be kept as short

as possible, as should the PCB trace to the ground via.

Distance of the ferrite bead and bulk decoupling from

the device is less critical.

4. An optimum layout is one with all components on the

same side of the board, minimizing vias through other

signal layers (any ferrite beads and bulk decoupling

capacitors can be mounted on the back). Other signal

traces should be routed away from the ICS557-06.This

includes signal traces just underneath the device, or on

layers adjacent to the ground plane layer used by the

device.

R 475

6*IREF

=2.3 mA

IREF

See Output Termination

Sections - Pages 3 ~ 5

Ω

ICS557-06 Datasheet(PDF) 4 Page - Integrated Circuit Systems