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DA14580 Datasheet(PDF) 3 Page - Dialog Semiconductor

Part # DA14580
Description  Bluetooth Smart changed to Bluetooth low energy as per Bluetooth SIG directive.
PDF  4 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

DA14580 Datasheet(HTML) 3 Page - Dialog Semiconductor

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Datasheet
Revision 3.4
09-Nov-2016
CFR0011-120-01
3 of 4
© 2014 Dialog Semiconductor
DA14580
Revision History
FINAL
• Supply voltage condition removed for: IBAT(DP_SLP)_BUCK_1kB, IBAT(DP_SLP)_BUCK_2kB,
IBAT(DP_SLP)_BUCK_8kB, IBAT(ACT_RX)_BOOST, IBAT(ACT_TX)_BOOST, IBAT(ACT_RX)_BUCK,
IBAT(ACT_TX)_BUCK. Default measurement conditions apply.
• Table 295 (Radio: AC characteristics), p.151: Note 15 (reference to AN-B-017) removed.
5
V3.0 (September 25, 2014)
5.1 CRITICAL CHANGES
• Product status changed to Production, datasheet status changed to Final.
• Section 4 (Specifications), p.17: added MIN/MAX definitions and reference diagrams for Boost and Buck mode
(Figures 11 and 12).
• Table 3 (Absolute maximum ratings), p.19:
•VPIN(LIM)(default): condition text corrected, maximum value changed from 3.6 V to min(3.6, VBAT_RF+0.2) V.
•VBAT(LIM)VBAT1V: minimum value changed from 0.9 V to -0.1 V.
•VBAT(LIM)VBAT3V: minimum value changed from 1.8 V to -0.1 V.
•VPIN(LIM)(1V2): minimum value changed from 0 V to -0.2 V, maximum value changed from 1.2 V to min(1.2,
VBAT_RF+0.2) V.
• Added parameter VPIN(LIM)(VDCDC_RF) with minimum value -0.2 V, maximum value min(2, VBAT_RF+0.2) V.
• Added parameter VPIN(LIM)(XTAL32Kp) with minimum value -0.2 V, maximum value min(1.5, VBAT_RF+0.2) V.
•VESD(MM)(WLCSP34): maximum value changed from 175 V to 200 V.
• Table 4 (Recommended operating conditions), p.20:
•VPP: specification changed from 6.55 V, 6.8 V, 7.05 V (Min, Typ, Max) to 6.6 V, 6.7 V, 6.8 V (Min, Typ, Max);
added condition TJ  50 C.
•VBAT(VBAT3V): also applies to pin VBAT_RF, conditions updated accordingly.
• Added parameter VBAT(VBAT3V)NO_OTP with minimum value 1.8 V, maximum value 3.3 V and condition
‘OTP not programmed’.
•VPIN(default): maximum value changed from 3.3 V to min(3.3, VBAT_RF+0.2).
• Added parameter VPIN(VDCDC_RF) with minimum value 0 V, maximum value 2 V.
• Note 2: added text ‘Trim values programmed in the OTP as well as the application image, should be copied into
RAM while VBAT3V >= 2.5 V.’.
• Table 6 (Timing characteristics), p.22:
• Added Note 3 to typical values of tSTA(BOOST) and tSTA(BUCK): ‘Worst-case value under Normal Operating
Conditions.’
• Table 7 (16 MHz Crystal Oscillator: Recommended operating conditions), p.22:
•
fXTAL(16M): Min/Max values changed from -15/+15 ppm to -20/+20 ppm. Added Note 4: ‘Using the internal
varicaps a wide range of crystals can be trimmed to the required tolerance.’
• Added parameter
fXTAL(16M)UNT with Min/Max values -40/+40 ppm, condition ‘untrimmed’ and Note 5:
Maximum allowed frequency tolerance for compensation by the internal varicap trimming mechanism.’
5.2 NON CRITICAL CHANGES
• Figure 2 and Figure 3 (system diagrams for Boost mode and Buck Mode) moved from section 1 (Block diagram)
to section 4 (Specifications) and renamed to Figure 11 and Figure 12.
• Figures 8 and 9 (Supply overview), p.15 and p.16: component values removed.
• Figure 11 (System diagram: Boost mode) updated, p.17:
• Pin RST not connected
• Pin VDCDCA renamed to VDCDC_RF



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