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DA14580 Datasheet(PDF) 3 Page - Dialog Semiconductor |
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DA14580 Datasheet(HTML) 3 Page - Dialog Semiconductor |
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3 / 4 page ![]() Datasheet Revision 3.4 09-Nov-2016 CFR0011-120-01 3 of 4 © 2014 Dialog Semiconductor DA14580 Revision History FINAL • Supply voltage condition removed for: IBAT(DP_SLP)_BUCK_1kB, IBAT(DP_SLP)_BUCK_2kB, IBAT(DP_SLP)_BUCK_8kB, IBAT(ACT_RX)_BOOST, IBAT(ACT_TX)_BOOST, IBAT(ACT_RX)_BUCK, IBAT(ACT_TX)_BUCK. Default measurement conditions apply. • Table 295 (Radio: AC characteristics), p.151: Note 15 (reference to AN-B-017) removed. 5 V3.0 (September 25, 2014) 5.1 CRITICAL CHANGES • Product status changed to Production, datasheet status changed to Final. • Section 4 (Specifications), p.17: added MIN/MAX definitions and reference diagrams for Boost and Buck mode (Figures 11 and 12). • Table 3 (Absolute maximum ratings), p.19: •VPIN(LIM)(default): condition text corrected, maximum value changed from 3.6 V to min(3.6, VBAT_RF+0.2) V. •VBAT(LIM)VBAT1V: minimum value changed from 0.9 V to -0.1 V. •VBAT(LIM)VBAT3V: minimum value changed from 1.8 V to -0.1 V. •VPIN(LIM)(1V2): minimum value changed from 0 V to -0.2 V, maximum value changed from 1.2 V to min(1.2, VBAT_RF+0.2) V. • Added parameter VPIN(LIM)(VDCDC_RF) with minimum value -0.2 V, maximum value min(2, VBAT_RF+0.2) V. • Added parameter VPIN(LIM)(XTAL32Kp) with minimum value -0.2 V, maximum value min(1.5, VBAT_RF+0.2) V. •VESD(MM)(WLCSP34): maximum value changed from 175 V to 200 V. • Table 4 (Recommended operating conditions), p.20: •VPP: specification changed from 6.55 V, 6.8 V, 7.05 V (Min, Typ, Max) to 6.6 V, 6.7 V, 6.8 V (Min, Typ, Max); added condition TJ 50 C. •VBAT(VBAT3V): also applies to pin VBAT_RF, conditions updated accordingly. • Added parameter VBAT(VBAT3V)NO_OTP with minimum value 1.8 V, maximum value 3.3 V and condition ‘OTP not programmed’. •VPIN(default): maximum value changed from 3.3 V to min(3.3, VBAT_RF+0.2). • Added parameter VPIN(VDCDC_RF) with minimum value 0 V, maximum value 2 V. • Note 2: added text ‘Trim values programmed in the OTP as well as the application image, should be copied into RAM while VBAT3V >= 2.5 V.’. • Table 6 (Timing characteristics), p.22: • Added Note 3 to typical values of tSTA(BOOST) and tSTA(BUCK): ‘Worst-case value under Normal Operating Conditions.’ • Table 7 (16 MHz Crystal Oscillator: Recommended operating conditions), p.22: • fXTAL(16M): Min/Max values changed from -15/+15 ppm to -20/+20 ppm. Added Note 4: ‘Using the internal varicaps a wide range of crystals can be trimmed to the required tolerance.’ • Added parameter fXTAL(16M)UNT with Min/Max values -40/+40 ppm, condition ‘untrimmed’ and Note 5: Maximum allowed frequency tolerance for compensation by the internal varicap trimming mechanism.’ 5.2 NON CRITICAL CHANGES • Figure 2 and Figure 3 (system diagrams for Boost mode and Buck Mode) moved from section 1 (Block diagram) to section 4 (Specifications) and renamed to Figure 11 and Figure 12. • Figures 8 and 9 (Supply overview), p.15 and p.16: component values removed. • Figure 11 (System diagram: Boost mode) updated, p.17: • Pin RST not connected • Pin VDCDCA renamed to VDCDC_RF |
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