NXP Semiconductors

MPXV7007

Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and

calibrated

4.1 Ordering options

# of Ports

Pressure type

Device name

Package

options

SOT

no.

None Single Dual Gauge Differential Absolute

Device

marking

Small Outline Package

MPXV7007DP

Trays

1693-1

•

•

MPXV7007DP

MPXV7007DPT1

Tape and Reel 1693-1

•

•

MPXV7007DP

MPXV7007GC6U

Rails

1854-1

•

•

MPXV7007G

MPXV7007GC6T1 Tape and Reel 1854-1

•

•

MPXV7007G

MPXV7007GP

Trays

1693-3

•

•

MPXV7007GP

Table 2. Ordering options

MPXV7007DP/DPT1

CASE 1351-01

SOT1693-1

MPXV7007GC6U/C6T1

CASE 482A-01

SOT1854-1

MPXV7007GP

CASE 1369-01

SOT1693-3

Small outline packages

5 Block diagram

aaa-040606

THIN FILM

TEMPERATURE

COMPENSATION

AND

GAIN STAGE #1

2

3

4

Sensing

element

Pins 1, 5, 6, 7 and 8 are NO CONNECTS

for small outline package device

GND

GAIN STAGE #2

AND

GROUND

REFERENCE

SHIFT CIRCUITRY

Figure 1. Integrated pressure sensor schematic

MPXV7007

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2021. All rights reserved.

Product data sheet

Rev. 4 — 26 January 2021

2 / 19