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IMX6SDLIEC Datasheet(PDF) 1 Page - NXP Semiconductors

Part # IMX6SDLIEC
Description  i.MX 6Solo/6DualLite Applications Processors for Industrial Products
PDF  161 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMX6SDLIEC Datasheet(HTML) 1 Page - NXP Semiconductors

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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SDLIEC
Rev. 9, 11/2018
Package Information
Plastic Package
BGA Case 2240 21 x 21 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products
MCIMX6UxCxxxxxB
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1
Introduction
The i.MX 6Solo/6DualLite processors represent the
latest achievement in integrated multimedia-focused
products offering high-performance processing with a
high degree of functional integration to meet the
demands of high-end, advanced industrial and medical
applications requiring graphically rich and highly
responsive user interfaces.
The processors feature advanced implementation of
single/dual Arm® Cortex®-A9 core, which operates at
speeds of up to 800 MHz. They include 2D and 3D
graphics processors, 1080p video processing, and
integrated power management. Each processor provides
a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory
interface and a number of other interfaces for connecting
peripherals, such as WLAN, Bluetooth®, GPS, hard
drive, displays, and camera sensors.
i.MX 6Solo/6DualLite
Applications Processors
for Industrial Products
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.3
Updated Signal Naming Convention . . . . . . . . . . . .8
2
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
2.1
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.1
Special Signal Considerations . . . . . . . . . . . . . . . .20
3.2
Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .22
4.1
Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .22
4.2
Power Supplies Requirements and Restrictions . .32
4.3
Integrated LDO Voltage Regulator Parameters . . .33
4.4
PLL’s Electrical Characteristics . . . . . . . . . . . . . . .35
4.5
On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .36
4.6
I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .38
4.7
I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .42
4.8
Output Buffer Impedance Parameters . . . . . . . . . .46
4.9
System Modules Timing . . . . . . . . . . . . . . . . . . . . .48
4.10 General-Purpose Media Interface (GPMI) Timing .61
4.11 External Peripheral Interface Parameters . . . . . . .69
5
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .127
5.1
Boot Mode Configuration Pins . . . . . . . . . . . . . . .127
5.2
Boot Device Interface Allocation . . . . . . . . . . . . .128
6
Package Information and Contact Assignments . . . . . .129
6.1
Updated Signal Naming Convention . . . . . . . . . .129
6.2
21x21 mm Package Information. . . . . . . . . . . . . .130
7
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .155


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