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USB4712 Datasheet(PDF) 37 Page - Microchip Technology |
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USB4712 Datasheet(HTML) 37 Page - Microchip Technology |
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37 / 43 page ![]() 2018-2021 Microchip Technology Inc. DS00002774G-page 37 USB4712 FIGURE 10-2: 40-VQFN PACKAGE (LAND PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 3.60 3.60 MILLIMETERS 0.40 BSC MIN E MAX 4.90 Contact Pad Length (X40) Contact Pad Width (X40) Y1 X1 0.85 0.20 Microchip Technology Drawing C04-236A NOM SILK SCREEN 1 2 40 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 4.90 Contact Pad to Center Pad (X40) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: G2 Contact Pad to Contact Pad (X36) G1 0.20 |
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