Data Sheet D16153EJ1V0DS

4

2SD2230

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC sales representative.

Surface Mounting Type

For details of the recommended soldering conditions, refer to the document

Semiconductor Device Mounting

Technology Manual (C10535E).

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 230

°C, Time: 30 sec. max. (at 210°C or higher),

Count: Once, Exposure limit: None*

IR30-00

VPS

Package peak temperature: 215

°C, Time: 40 sec. max. (at 200°C or higher),

Count: Once, Exposure limit: None*

VP15-00

Partial heating

Pin temperature: 300

°C max., Time: 10 sec. max. Exposure limit: None*

O

* After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).