SL3S1205FUD2SLASHHAP datasheet(10/38 Pages) NXP

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NXP Semiconductors

SL3S1205_15

UCODE 8/8m

not to scale!

(1)

(10)

(2)

(12)

(4)

(3)

TP2

TP1

RF2

RF1

(6)

(7)

(8)

(9)

(5)

(13)

(11)

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1. X-scribe line width not expanded: 6.6 μm (Expanded, typically 15 μm)

2. Y-scribe line width not expanded: 6.6 μm (Expanded, typically 15 μm)

3. Chip step, Y-length: 477.6 μm

4. Chip step, X-length: 467.6 μm

5. Bump to bump distance X (RF1 - RF2): 115 μm

6. Distance bump to metal sealring Y: 17.5 μm

7. Bump size (TP1, TP2) Y: 100 μm

8. Bump to bump distance Y (RF1 - TP2, RF2 - TP1): 50 μm

9. Bump size (RF1, RF2) Y: 278 μm

10. Distance bump to metal sealring X: 17.5 μm

11. Bump size (TP1, TP2) X: 134.2 μm

12. Bump size (RF1, RF2) X: 151.5 μm

13. Distance bump to metal sealring X: 435.5 μm

Remark: TP1 and TP2 are electrically disconnected after dicing

Figure 5. UCODE 8/8m, 12" wafer layout, Large Pads, plasma dicing

SL3S1205_15

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.5 — 1 April 2021

COMPANY PUBLIC

398435

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