MAX11642 datasheet(2/22 Pages) MAXIM

2 / 22 page

8-Bit, 16-/8-Channel, 300ksps ADCs

with FIFO and Internal Reference

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = +2.7V to +3.6V (MAX11639/MAX11643), VDD = +4.75V to +5.25V (MAX11638/MAX11642), fSAMPLE = 300kHz, fSCLK =

4.8MHz (external clock 50% duty cycle), VREF = 2.5V (MAX11639/MAX11643), VREF = 4.096V (MAX11638/MAX11642), TA = TMIN to

TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VDD to GND ..............................................................-0.3V to +6V

CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)

AIN0–AIN13, CNVST/AIN_,

REF to GND ...........................................-0.3V to (VDD + 0.3V)

Maximum Current into Any Pin............................................50mA

Continuous Power Dissipation (TA = +70°C)

16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW

24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-60°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC ACCURACY (Note 3)

Resolution

RES

Bits

Integral Nonlinearity

INL

±0.5

LSB

Differential Nonlinearity

DNL

No missing codes over temperature

±0.5

LSB

Offset Error

±0.5

±1

LSB

Gain Error

(Note 4)

±0.5

±1

LSB

Offset Error Temperature

Coefficient

±2

ppm/°C

FSR

Gain Temperature Coefficient

±0.8

ppm/°C

Channel-to-Channel Offset

Matching

±0.1

LSB

DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, fSCLK = 4.8MHz)

Signal-to-Noise Plus Distortion

SINAD

Total Harmonic Distortion

THD

Up to the 5th harmonic

-70

dBc

Spurious-Free Dynamic Range

SFDR

-72

dBc

Intermodulation Distortion

IMD

fIN1 = 29.9kHz, fIN2 = 30.1kHz

-67

dBc

Full-Power Bandwidth

-3dB point

MHz

Full-Linear Bandwidth

S/(N + D) > 48dB

100

kHz

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

16 QSOP

Junction-to-Ambient Thermal Resistance (

θJA)...............105°C/W

Junction-to-Case Thermal Resistance (

θJC)......................37°C/W

24 QSOP

Junction-to-Ambient Thermal Resistance (

θJA)................88°C/W

Junction-to-Case Thermal Resistance (

θJC).......................34°C/W

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