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05293 Datasheet(PDF) 1 Page - 3M Electronics

Part # 05293
Description  Double Coated Tape 9490LE
PDF  4 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

05293 Datasheet(HTML) 1 Page - 3M Electronics

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3M™ Double Coated Tape 9490LE
Product Description
3M™ Double Coated Tape 9490LE with 3M™ Laminating Adhesive 300LSE provides high bond strength to most surfaces,
including many low surface energy plastics such as polypropylene and powder coated paints. The acrylic adhesive also
provides excellent adhesion to surfaces contaminated lightly with oil typically used with machine parts. 3M double coated
tape 9490LE offers the added feature of 3M™ Laminating Adhesive 300MP on one side to provide excellent bond strength
to a variety of foam and fabric materials.
3
Technical Data
November 2011
Construction
Faceside1
Carrier
Backside2
Liner
Total Tape
Product
Adhesive
Type/
Adhesive
Color, Type,
Liner
Thickness
Number
Thickness
Thickness
Thickness
Print
Caliper
(w/o liner)
3M™ Double
2.8 mil
Clear PET3
3.4 mil
Tan, 58#,
4.2 mil
6.7 mil
Coated Tape
(0.071mm)
0.5 mil
(0.086mm)
Polycoated Kraft
(0.11mm)
(0.17mm)
9490LE4
(0.013mm)
“3M 300LSE”
Note 1: Faceside (FS) adhesive 300MP is on the interior of the roll, exposed when unwound.
Note 2: Backside (BS) adhesive 300LSE is on the exterior of the roll, exposed when liner is removed.
Note 3: PET (Polyester).
Note 4: The caliper listed is based on a calculation from manufacturing controlled adhesive coat weights using a density of 1.012 g/cc.
Features
• This tape has a moisture resistant polycoated kraft liner which can withstand high humidity conditions with minimal
cockling or wrinkling.
• This tape has a film carrier which can add dimensional stability to foams and other substrates and also make it easier to
handle the tape during slitting and die-cutting.
• The bond strength of 3M™ Laminating Adhesive 300LSE increases as a function of time and temperature, and has very
high initial adhesion.
Application Ideas
• Foam attachment for electronic assemblies.
• Low surface energy substrates.
• Graphic attachment of high surface energy and low surface energy.


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