Ratings

1.1 Thermal handling ratings

Symbol

Description

Min.

Max.

Unit

Notes

Storage temperature

–55

150

°C

1

Solder temperature, lead-free

—

260

°C

2

1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.

2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

1.2 Moisture handling ratings

Symbol

Description

Min.

Max.

Unit

Notes

MSL

Moisture sensitivity level

—

3

—

1

1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

1.3 ESD handling ratings

Symbol Description1

Min

Typ.

Max

Unit

Notes

Electrostatic discharge voltage, human body model

-2000

—

+2000

V

2

Electrostatic discharge voltage, charged-device model

-500

—

+500

V

3

Latch-up current at ambient temperature of 85 °C

-100

—

+100

mA

4

1. Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions,

unless otherwise noted.

2. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human

Body Model (HBM).

3. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.

4. Determined according to JEDEC Standard JESD78, IC Latch-Up Test.

1

Ratings

MWPR1516 16 KB Flash, Rev2, 1/2015.

5

Freescale Semiconductor, Inc.