MAX98358 datasheet(4/28 Pages) MAXIM

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VDD, PDM_CLK and PDM_DATA to GND ..............-0.3V to +6V

All Other Pins to GND .............................. -0.3V to (VDD + 0.3V)

Continuous Current In/Out of VDD/GND/OUT_..................±1.6A

Continuous Input Current (all other pins).........................±20mA

Duration of OUT_ Short Circuit to GND or VDD…....Continuous

Duration of OUTP Short to OUTN.............................Continuous

Continuous Power Dissipation ..............................(TA = +70°C)

WLP (derate 13.7mW/°C above +70°C)....................1096mW

TQFN (derate 20.8mW/°C above +70°C)..................1666mW

Junction Temperature......................................................+150°C

Operating Temperature Range........................... -40°C to +85°C

Storage Temperature Range............................ -65°C to +150°C

Soldering Temperature (reflow).......................................+260°C

Lead Temperature (soldering, 10s, TQFN) .....................+300°C

WLP

Junction-to-Ambient Thermal Resistance (θJA) ..........73°C/W

Junction-to-Case Thermal Resistance (θJC)...............50°C/W

TQFN

Junction-to-Ambient Thermal Resistance (θJA) ..........48°C/W

Junction-to-Case Thermal Resistance (θJC).................7°C/W

(Note 1)

(VDD = 5V, VGND = 0V, GAIN = VDD (+6dB). PDM_CLK = 3.072MHz, speaker loads (ZSPK) connected between OUTP and OUTN,

ZSPK = ∞, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

VDD

Guaranteed by PSSR test

2.5

5.5

Undervoltage Lockout

UVLO

1.4

1.8

2.3

Quiescent Current

IDD

TA = +25°C

2.2

2.7

TA = +25°C, VDD = 3.7V

1.8

2.2

Shutdown Current

ISHDN

SD_MODE

= 0V, TA = +25°C

0.6

µA

Standby Current

ISTNDBY

SD_MODE

= 1.8V, no PDM_CLK,

TA = +25°C

340

400

µA

Turn-On Time

tON

Time from receipt of first clock cycle to full

operation

0.6

0.7

Output Offset Voltage

VOS

TA = +25°C, gain = 15dB

±0.3

±2.5

Click-and-Pop Level

KCP

Peak voltage, TA =

+25°C, A-weighted,

32 samples per

second (Note 3)

Into shutdown

-72

dBV

Out of shutdown

-66

Power-Supply Rejection Ratio

PSRR

VDD = 2.5V to 5.5V, TA = +25°C

TA = +25°C

(Notes 3, 4)

f = 217Hz,

200mVP-P ripple

f = 10kHz,

200mVP-P ripple

MAX98358

PDM Input Class D Audio Power Amplifier

www.maximintegrated.com

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