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MPC8347ECVRADDB Datasheet(PDF) 57 Page - NXP Semiconductors |
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MPC8347ECVRADDB Datasheet(HTML) 57 Page - NXP Semiconductors |
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57 / 99 page  MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12 Freescale Semiconductor 57 Package and Pin Listings 18.3 Package Parameters for the MPC8347EA PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 620 plastic ball grid array (PBGA). Package outline 29 mm × 29 mm Interconnects 620 Pitch 1.00 mm Module height (maximum) 2.46 mm Module height (typical) 2.23 mm Module height (minimum) 2.00 mm Solder balls 62 Sn/36 Pb/2 Ag (ZQ package) 96.5 Sn/3.5Ag (VR package) Ball diameter (typical) 0.60 mm |
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