OPA2191 datasheet(6/59 Pages) TI

6 / 59 page

6.4 Thermal Information: OPA191

THERMAL METRIC(1)

OPA191

UNIT

D (SOIC)

DGK (VSSOP)

DBV (SOT)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

115.8

180.4

158.8

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

60.1

67.9

60.7

°C/W

RθJB

Junction-to-board thermal resistance

56.4

102.1

44.8

°C/W

ψJT

Junction-to-top characterization parameter

12.8

10.4

1.6

°C/W

ψJB

Junction-to-board characterization parameter

55.9

100.3

4.2

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information: OPA2191

THERMAL METRIC(1)

OPA2191

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

107.9

158

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

53.9

48.6

°C/W

RθJB

Junction-to-board thermal resistance

48.9

78.7

°C/W

ψJT

Junction-to-top characterization parameter

6.6

3.9

°C/W

ψJB

Junction-to-board characterization parameter

48.3

77.3

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information: OPA4191

THERMAL METRIC(1)

OPA4191

UNIT

D (SOIC)

PW (TSSOP)

RUM (QFN)

14 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

86.4

108.1

33.0

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

46.3

26.3

25.1

°C/W

RθJB

Junction-to-board thermal resistance

41.0

54.4

11.6

°C/W

ψJT

Junction-to-top characterization parameter

11.3

1.4

0.2

°C/W

ψJB

Junction-to-board characterization parameter

40.7

53.3

11.5

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

2.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

OPA191, OPA2191, OPA4191

SBOS701D – DECEMBER 2015 – REVISED AUGUST 2021

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