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LC0404FC Datasheet(PDF) 6 Page - Protek Devices

Part # LC0404FC
Description  LOW CAPACITANCE FLIP CHIP ARRAY
PDF  6 Pages
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Manufacturer  PROTEC [Protek Devices]
Direct Link  http://www.protekdevices.com
Logo PROTEC - Protek Devices

LC0404FC Datasheet(HTML) 6 Page - Protek Devices

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www.protekdevices.com
05157.R6 4/05
LC0404FC3.3C
thru
LC0404FC36C
PACKAGE OUTLINE & DIMENSIONS
A
F
G
H
I
0.51
0.15 SQ
0.71
0.99
0.51
0.020
0.006 SQ
0.028
0.039
0.020
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred: Using 0.1mm (0.004”) stencil.
MOUNTING PAD LAYOUT - Option 2
SOLDER PRINT
0.014” - [0.36] DIA.
A
I
SOLDER MASK
DIE
SOLDER
BUMP
COPPER
CONTACTS
0.009” [0.23] DIA.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0404FC05C-T75-1).
3.
8mm Paper Tape: 7 Inch Reels - 10,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., LC0404FC05C-T710-2).
4. Suffix - LF = Lead-Free,
i.e.,
LC0404FC05C-LF-T710-2.
Outline & Dimensions: Rev4 - 9/04, 06022
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
Dual Die - 0404
Laser
Orientation
Line
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com



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