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[v1-07] 2016-Sep-09

AS5601 − Absolute Maximum R atings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Operating

Conditions is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 5:

Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD5V

DC supply voltage at

VDD5V pin

-0.3

6.1

5.0V operation mode

VDD3V3

DC supply voltage at

VDD3V3 pin

-0.3

4.0

3.3V operation mode

VAIO

Voltage at all digital or

analog pins

-0.3

VDD + 0.3

ISCR

Input current (latch-up

immunity)

-100

100

JESD78

Continuous Power Dissipation (TA = 70°C)

Continuous power

dissipation

Electrostatic Discharge

ESDHBM

Electrostatic discharge

HBM (human body model)

±1

MIL 883 E method 3015.7

Temperature Ranges and Storage Conditions

TSTRG

Storage temperature range

-55

125

°C

TBODY

Package body temperature

260

°C

ICP/JEDEC J-STD-020

The reflow peak soldering

temperature (body

temperature) is specified

according to IPC/JEDEC

J-STD-020 “Moisture/Reflow

Sensitivity Classification for

Non-hermetic Solid State

Surface Mount Devices.” The

lead finish for Pb-free leaded

packages is “Matte Tin” (100%

Sn)

RHNC

Relative humidity

(non-condensing)

585

MSL

Moisture sensitivity level

ICP/JEDEC J-STD-033

Absolute Maximum Ratings

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