Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................4

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 6

7.1 Absolute Maximum Ratings ....................................... 6

7.2 ESD Ratings .............................................................. 6

7.3 Thermal Information ...................................................7

7.4 Recommended Operating Conditions ........................7

7.5 Source or Drain Continuous Current ..........................7

7.6 ±15 V Dual Supply: Electrical Characteristics ...........8

7.7 ±15 V Dual Supply: Switching Characteristics .......... 9

7.8 ±20 V Dual Supply: Electrical Characteristics .......... 11

7.9 ±20 V Dual Supply: Switching Characteristics ......... 12

7.10 44 V Single Supply: Electrical Characteristics ...... 14

7.11 44 V Single Supply: Switching Characteristics ......15

7.12 12 V Single Supply: Electrical Characteristics ...... 17

7.13 12 V Single Supply: Switching Characteristics ..... 18

7.14 Typical Characteristics............................................ 20

8 Parameter Measurement Information.......................... 25

8.1 On-Resistance.......................................................... 25

8.2 Off-Leakage Current................................................. 25

8.3 On-Leakage Current................................................. 26

8.4 Transition Time......................................................... 26

8.5 tON(EN) and tOFF(EN) .................................................. 27

8.6 Break-Before-Make...................................................27

8.7 tON (VDD) Time............................................................28

8.8 Propagation Delay.................................................... 28

8.9 Charge Injection........................................................29

8.10 Off Isolation.............................................................29

8.11 Crosstalk................................................................. 30

8.12 Bandwidth............................................................... 30

8.13 THD + Noise........................................................... 31

8.14 Power Supply Rejection Ratio (PSRR)................... 31

9 Detailed Description......................................................32

9.1 Overview................................................................... 32

9.2 Functional Block Diagram......................................... 32

9.3 Feature Description...................................................32

9.4 Device Functional Modes..........................................34

9.5 Truth Tables.............................................................. 34

10 Application and Implementation................................ 35

10.1 Application Information........................................... 35

10.2 Typical Application.................................................. 35

11 Power Supply Recommendations..............................37

12 Layout...........................................................................38

12.1 Layout Guidelines................................................... 38

12.2 Layout Example...................................................... 39

13 Device and Documentation Support..........................40

13.1 Documentation Support.......................................... 40

13.2 Receiving Notification of Documentation Updates..40

13.3 Support Resources................................................. 40

13.4 Trademarks.............................................................40

13.5 Electrostatic Discharge Caution..............................40

13.6 Glossary..................................................................40

14 Mechanical, Packaging, and Orderable

Information.................................................................... 40

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (April 2021) to Revision D (September 2021)

Page

• Changed the status of the QFN packages for TMXU7208 and TMUX7209 from: preview to: active ................ 1

• Added ESD detail for RUM package.................................................................................................................. 6

• Added the Integrated Pull-Down Resistor on Logic Pins section......................................................................32

• Updated the Ultra-Low Charge Injection section.............................................................................................. 33

• Updated the TMUX720x Layout Example figures in the Layout Example section............................................39

Changes from Revision B (April 2021) to Revision C (April 2021)

Page

• Added ESD detail for TMUX7209....................................................................................................................... 6

Changes from Revision A (March 2021) to Revision B (April 2021)

Page

• Included TMUX7209PW..................................................................................................................................... 4

Changes from Revision * (December 2020) to Revision A (March 2021)

Page

• Added high current support for WQFN in Features section................................................................................1

• Added thermal information for QFN package..................................................................................................... 7

TMUX7208, TMUX7209

SCDS418D – JULY 2020 – REVISED SEPTEMBER 2021

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