6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input Voltage

–0.3

6

V

Bias Voltage

–0.3

6

V

Control Pin Voltage

–0.3

6

V

Maximum Current

10

A

Junction temperature

Internally

Limited

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input Voltage

0.2

5.5

V

Bias Voltage

2.2

5.5

V

Control Pin Voltage

0

5.5

V

Ambient Temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC (1)

TPS22998

UNIT

RYZ (WQFN)

10 PINS

Junction-to-ambient thermal resistance

84.1

°C/W

Junction-to-case (top) thermal resistance

77.5

°C/W

Junction-to-board thermal resistance

16.6

°C/W

Junction-to-top characterization parameter

4.0

°C/W

Junction-to-board characterization parameter

16.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS22998

SLVSG05 – OCTOBER 2021

www.ti.com

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