LTC3886 datasheet(2/26 Pages) AD

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LTC7883

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

(Note 1)

TOP VIEW

10 11

BGA PACKAGE

99-LEAD (9mm × 7.5mm × 1.29mm)

TJMAX = 125°C, θJA = 32°C/W,

θJCtop = 17°C/W, θJCbottom = 12.1°C/W, θJB = 14.5°C/W,

WEIGHT = TBDg,

θ VALUES DETERMINED PER JEDEC 51-9, 51-12

PIN 1

ORDER INFORMATION

VCC[A/B] Supply.......................................... –0.3V to 15V

VINS[A/B] .................................................. –0.3V to 40V

VSNS[A/B][1:0]M.............................................. –0.3V to 1V

VSNS[A/B][1:0]P, CS[A/B][1:0]P/M................... –0.3V to 6V

FB[A/B][1:0], COMP[A/B][1:0],

TSNS[A/B][1:0], IAVGND[A/B],

IAVG[A/B][1:0] ...................................... –0.3V to 3.6V

SYNC[A/B], FLT[A/B][1:0], WP[A/B],

PG[A/B][1:0], SHCLK[A/B].................... –0.3V to 3.6V

SCL[A/B], SDA[A/B], RUN[A/B][1:0],

ALERT[A/B]............................................ –0.3V to 5.5V

ASEL0[A/B], ASEL1[A/B],

VO[A/B][1:0]CFG, FCFG[A/B],

PCFG[A/B] .......................................... –0.3V to 2.75V

PWM[A/B][1:0], VDD25[A/B] .............................. (Note 13)

VDD33[A/B] ........................................................ (Note 14)

Operating Junction Temperature

(Notes 2, 3)...................................... –40°C to 125°C*

Storage Temperature Range ............ –65°C to 150°C*

Absolute Maximum Junction Temperature ....... 125°C

*See Derating EEPROM Retention at Temperature in the

Applications Information section for junction tempera-

tures in excess of 125°C.

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

OPERATING JUNCTION

TEMPERATURE RANGE

DEVICE

FINISH CODE

LTC7883AY#PBF

SAC305 (RoHS)

LTC7883Y

BGA

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature

ranges. *The temperature grade is identified by a label on the shipping

container.

• Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

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