CC2652RSIP datasheet(5/67 Pages) TI

5 / 67 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 2

3 Description.......................................................................2

4 Functional Block Diagram.............................................. 3

5 Revision History.............................................................. 5

6 Device Comparison......................................................... 6

7 Terminal Configuration and Functions..........................7

7.1 Pin Diagram................................................................ 7

7.2 Signal Descriptions – SIP Package............................ 8

7.3 Connections for Unused Pins and Modules................9

8 Specifications................................................................ 10

8.1 Absolute Maximum Ratings...................................... 10

8.2 ESD Ratings............................................................. 10

8.3 Recommended Operating Conditions.......................10

8.4 Power Supply and Modules...................................... 10

8.5 Power Consumption - Power Modes.........................11

8.6 Power Consumption - Radio Modes......................... 12

8.7 Nonvolatile (Flash) Memory Characteristics............. 12

8.8 Thermal Resistance Characteristics......................... 12

8.9 RF Frequency Bands................................................ 12

8.10 Bluetooth Low Energy - Receive (RX).................... 13

8.11 Bluetooth Low Energy - Transmit (TX).................... 16

8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4

GHz (OQPSK DSSS1:8, 250 kbps) - RX.................... 17

8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4

GHz (OQPSK DSSS1:8, 250 kbps) - TX.....................18

8.14 Timing and Switching Characteristics..................... 18

8.15 Peripheral Characteristics.......................................22

8.16 Typical Characteristics............................................ 30

9 Detailed Description......................................................36

9.1 Overview................................................................... 36

9.2 System CPU............................................................. 36

9.3 Radio (RF Core)........................................................37

9.4 Memory..................................................................... 37

9.5 Sensor Controller...................................................... 39

9.6 Cryptography............................................................ 40

9.7 Timers....................................................................... 41

9.8 Serial Peripherals and I/O.........................................42

9.9 Battery and Temperature Monitor............................. 42

9.10 µDMA......................................................................42

9.11 Debug......................................................................42

9.12 Power Management................................................43

9.13 Clock Systems........................................................ 44

9.14 Network Processor..................................................44

9.15 Device Certification and Qualification..................... 45

9.16 Module Markings.....................................................47

9.17 End Product Labeling..............................................47

9.18 Manual Information to the End User....................... 47

10 Application, Implementation, and Layout................. 48

10.1 Application Information........................................... 48

10.2 Device Connection and Layout Fundamentals....... 49

10.3 PCB Layout Guidelines...........................................49

10.4 Reference Designs................................................. 53

10.5 Junction Temperature Calculation...........................54

11 Environmental Requirements and SMT

Specifications ...............................................................55

11.1 PCB Bending...........................................................55

11.2 Handling Environment.............................................55

11.3 Storage Condition................................................... 55

11.4 PCB Assembly Guide..............................................55

11.5 Baking Conditions................................................... 56

11.6 Soldering and Reflow Condition..............................57

12 Device and Documentation Support..........................58

12.1 Device Nomenclature..............................................58

12.2 Tools and Software................................................. 58

12.3 Documentation Support.......................................... 62

12.4 Support Resources................................................. 62

12.5 Trademarks.............................................................62

12.6 Electrostatic Discharge Caution..............................63

12.7 Glossary..................................................................63

13 Mechanical, Packaging, and Orderable

Information.................................................................... 64

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (February 2021) to Revision A (February 2022)

Page

• Updated numbering of sections, figures, and tables throughout the data sheet.................................................1

• Updated formatting throughout data sheet to match current documentation standards.....................................1

• Devices are now PRODUCTION DATA.............................................................................................................. 1

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CC2652RSIP

SWRS262A – FEBRUARY 2021 – REVISED FEBRUARY 2022

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