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CC2652RSIP Datasheet(PDF) 58 Page - Texas Instruments |
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CC2652RSIP Datasheet(HTML) 58 Page - Texas Instruments |
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58 / 67 page ![]() 12 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed as follows. 12.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date- code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, XCC2652RSIP is in preview; therefore, an X prefix/identification is assigned). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGZ). For orderable part numbers of CC2652RSIP devices in the RGZ (7-mm x 7-mm) package type, see the Package Option Addendum of this document, the Device Information in Section 3, the TI website (www.ti.com), or contact your TI sales representative. PREFIX X = Experimental device Blank = Qualified devie CONFIGURATION R = Regular P = +10 dBm PA included DEVICE SimpleLink™ Ultra-Low-Power Wireless MCU R = Large Reel PACKAGE DESIGNATOR MOT = LGA Package MODULE SIP = System-in-Package CC2652 R SIP MOT R Figure 12-1. Device Nomenclature 12.2 Tools and Software The CC2652RSIP device is supported by a variety of software and hardware development tools. Development Kit CC2652RSIP LaunchPad™ Development Kit The CC2652RSIP LaunchPad™ Development Kit enables development of high-performance wireless applications that benefit from low-power operation. The kit features the CC2652PSIP SimpleLink Wireless system-in-Package, which allows you to quickly evaluate and prototype 2.4-GHz wireless applications such as Bluetooth 5 Low Energy, Zigbee and Thread, plus combinations of these. The kit works with the LaunchPad ecosystem, easily enabling additional functionality like sensors, display and more. The built-in EnergyTrace™ CC2652RSIP SWRS262A – FEBRUARY 2021 – REVISED FEBRUARY 2022 www.ti.com 58 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP |
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