MIC5271 datasheet(5/20 Pages) MICROCHIP

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DS20005881B-page 5

MIC5271

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

—

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance SOT23-5

JA

—

235

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX) the

junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable

power dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA) ÷ θJA, where

θJA is 235°C/W. Exceeding the maximum allowable power dissipation will result in excessive die tempera-

ture, and the regulator will go into thermal shutdown. See the “Thermal Considerations” sub-section in the

Application Information for details.

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