TLV9352IDDFR datasheet(8/63 Pages) TI

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6.4 Thermal Information for Single Channel

THERMAL METRIC (1)

TLV9351

UNIT

DBV

(SOT-23)

DCK

(SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

185.7

202.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

108.2

101.5

°C/W

RθJB

Junction-to-board thermal resistance

54.5

47.8

°C/W

ψJT

Junction-to-top characterization parameter

31.2

18.8

°C/W

ψJB

Junction-to-board characterization parameter

54.2

47.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9352

UNIT

(SOIC)

DDF

(SOT-23)

DGK

(VSSOP)

(TSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

138.7

143.5

177.1

185.1

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

78.7

79.9

68.1

74.0

°C/W

RθJB

Junction-to-board thermal resistance

82.2

61.6

98.4

115.7

°C/W

ψJT

Junction-to-top characterization

parameter

27.8

5.7

12.1

12.3

°C/W

ψJB

Junction-to-board characterization

parameter

81.4

61.3

96.6

114.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

TBD

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9354

UNIT

(SOIC)

DYY

(SOT-23)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

101.2

110.6

131.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.8

53.7

52.1

°C/W

RθJB

Junction-to-board thermal resistance

57.2

35.3

75.6

°C/W

ψJT

Junction-to-top characterization parameter

18.6

2.2

8.1

°C/W

ψJB

Junction-to-board characterization parameter

56.5

35.0

74.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TLV9351, TLV9352, TLV9354

SBOS994E – NOVEMBER 2019 – REVISED JANUARY 2022

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