MPC8535E datasheet(26/127 Pages) NXP

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MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 7

Electrical Characteristics

Freescale Semiconductor

2.3

Power Characteristics

The estimated power dissipation for the core complex bus (CCB) versus the core frequency for this family of PowerQUICC III

chips is shown in the following table.

Table 5. Power Dissipation 5

Power Mode

Core

Frequen

CCB

Frequen

DDR

Frequen

VDD

Platfor

VDD

Core

Junction

Tempera

ture

Core Power

Platform Power9

Notes

(MHz)

(V)

(

°C)

mean7

Max

mean7

Max

Maximum (A)

600

400

1.0

105

/90

—

4.1/3.3

—

4.7/3.7

1, 3, 8

Thermal (W)

—

3.7/2.9

—

4.7/3.7

1, 4, 8

Typical (W)

1.5

—

1.5

—

1, 2

Doze (W)

1.2

1.9

1.4

1.9

Nap (W)

0.8

1.5

1.4

1.9

Sleep (W)

0.8

1.5

1.0

1.6

Deep Sleep

(W)

0.6

1.1

Maximum (A)

800

400

1.0

105

/ 90

—

4.5/3.7

—

4.7/3.7

1, 3, 8

Thermal (W)

—

3.9/3.1

—

4.7/3.7

1, 4, 8

Typical (W)

1.7

—

1.5

—

1, 2

Doze (W)

1.3

2.1

1.4

1.9

Nap (W)

0.8

1.5

1.4

1.9

Sleep (W)

0.8

1.5

1.0

1.6

Deep Sleep

(W)

0.6

1.1

1,6

Maximum (A)

1000

400

1.0

105

/ 90

—

4.8/4.0

—

4.7/3.7

1, 3, 8

Thermal (W)

—

4.1/3.3

—

4.7/3.7

1, 4, 8

Typical (W)

1.9

—

1.5

—

1, 2

Doze (W)

1.4

2.2

1.4

1.9

Nap (W)

0.8

1.6

1.4

1.9

Sleep (W)

0.8

1.6

1.0

1.6

Deep Sleep

(W)

0.6

1.1

1, 6

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