LTM4658EVPBF datasheet(20/26 Pages) AD

20 / 26 page

LTM4658

Rev. 0

For more information www.analog.com

Safety Considerations

The LTM4658 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

Layout Checklist/Example

The high integration of LTM4658 makes the PCB board

layoutverysimpleandeasy.However,tooptimizeitselectri-

cal and thermal performance, some layout considerations

are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, GND and VOUT pins as close as

possible to minimize high frequency noise.

• Place a dedicated power ground layer underneath

the unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

APPLICATIONS INFORMATION

• Use a separated GND ground copper area for compo-

nents connected to signal pins. Connect the AGND to

GND underneath the unit.

• For parallel modules, tie the VOUT, VFB, and COMP pins

together. Use an internal layer to closely connect these

pins together. The SSTT pin can be tied a common

capacitor for regulator soft-start.

• Bring out test points on the signal pins for monitoring.

Figure 15 givesagoodexampleoftherecommendedlayout.

GND

4658 F15

COUT

CIN

Figure 15. Recommended PCB Layout

LTM4658EVPBF Datasheet(PDF) 20 Page - Analog Devices

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